IEEE-Eta Kappa Nu offers companies, graduate schools, and IEEE Societies many different options to reach the world’s brightest students in electrical and computer engineering, computer science, and allied fields including three conferences, the award-winning THE BRIDGE Magazine, newsletters, and podcasts.

  • Conference sponsorship packages include opportunities to present exclusive 50-minute presentation, participation on a panel, dinner sponsorship, etc. Over 1,000 people attend our two virtual and one in-person conferences per year.  All sponsors receive our exclusive resume book.
  • THE BRIDGE digital magazine reaches over 30,000 members of the HKN community and is the 2nd most downloaded magazine on the IEEE app.
  • Choose your newsletter audience to tailor your message to HKN students, Chapter officers, graduate students, alumni, or All-HKN to reach over 25,000.
  • Partner with us to create an episode of Career Conversations, GradLab,  or HKN Connection podcast and have lasting content to promote your organization.

Custom sponsorship packages are available. Complete our Sponsorship interest form and we will contact you to discuss your needs and a package that works for you!

CONFERENCE OPPORTUNITIES

Student Leadership Conference

This is IEEE-HKN’s premier in-person leadership development and networking event for Chapter members from across the globe.

Sponsor Packages

Pathways to Industry Conference

In this virtual event, we bring together students and professionals to discuss personal career paths, share hard-earned insights, and offer practical advice for young engineer

Sponsor Packages

HKN TechX

Sponsor Packages

The IEEE-HKN TechX is our premier online Tech Conference bringing together industry experts and our members for networking and learning.

PUBLICATIONS

THE BRIDGE Magazine

THE BRIDGE is the award-winning, downloadable digital magazine of IEEE-Eta Kappa Nu which publishes three times a year.

Ad Packages

Graduate School Partnership Program

IEEE-HKN offers graduate schools opportunities to reach top junior and senior undergraduates who are on track to graduate with engineering or computer science degrees.

Grad opportunities
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